1. 2. 3. material content data sheet sales product name ipd30n03s2l-10 issued 29. august 2013 ma# MA000254531 package pg-to252-3-11 weight* 370.14 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 2.654 0.72 0.72 7172 7172 leadframe non noble metal iron 7439-89-6 0.234 0.06 634 inorganic material phosphorus 7723-14-0 0.070 0.02 190 non noble metal copper 7440-50-8 234.187 63.29 63.37 632699 633523 wire non noble metal aluminium 7429-90-5 0.936 0.25 0.25 2528 2528 encapsulation organic material carbon black 1333-86-4 1.263 0.34 3413 plastics epoxy resin - 22.105 5.97 59722 inorganic material silicondioxide 60676-86-0 102.948 27.81 34.12 278135 341270 leadfinish non noble metal tin 7440-31-5 3.740 1.01 1.01 10104 10104 plating non noble metal nickel 7440-02-0 0.091 0.02 245 inorganic material phosphorus 7723-14-0 0.000 0.00 0.02 1 246 solder noble metal silver 7440-22-4 0.048 0.01 129 non noble metal tin 7440-31-5 0.038 0.01 103 non noble metal lead 7439-92-1 1.823 0.49 0.51 4925 5157 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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